High Thermal Conductivity Pad Replacement: I designed and manufactured a replacement part for the original protection cover using CNC-machined aluminum for the frame and embedded a T2 pure copper block in the center to maximize heat transfer efficiency, creating a “fast lane” for CPU heat dissipation.
Please note that it should be made of metal material.
And do not attempt to use 3D printing! It may melt!
The author marked this model as their own original creation.