TPA3110D2 Bluetooth Amplifier enclosure case for sanwu board module

TPA3110D2 Bluetooth Amplifier enclosure. I added connector terminals to the board, had to bend the wires of the terminal block wider for the middle power terminal.

Added a second design for when you solder the wires to the board and did not use terminal connectors

You can clean or enlarge the four holes on the inside of the top with a 3.5mm drill bit

Print Settings

Printer: P3Steel

Rafts: No

Supports: No

Resolution: .2mm

Filament: Verbatim ABS Red 
 

Notes: 

The bottom was printed with RoHS Black PETG, had to clean the upright pins a bit.

Notes:
I printed both the ABS and the PETG with a brim to stop some of the corners lifting and deforming the enclosure (the first print lifted in the corners)

How I Designed This ===================

I use Fusion 360 from AutoCAD. Normally I do a sketch and then do the extrusion and cutting for the 3D shape, doing the bottom and top parts from the same sketch so as to get the fit right. For parts that must fit into each other, I trim 0.2 mm of the inside of the outer part and trim 0.2mm from the outside of the inner part and then get a nice tight fit due to the variances on the printer.

Please add a photo of your print to Makes